Ceramabond 503 Alumina Adhesive

　　Ceramabond? 503 is an inorganic, water-dispersed, aluminum oxide (alumina) filled adhesive that resists temperatures to 3200 °F (1760 °C) and is ideal for bonding alumina ceramics. It is applied easily by brush, spatula, or syringe and cures fully in 1-2 hours at 700 °F. Mechanical strength continues to improve with increases in temperature and tensile-shear strength of 900 psi can be achieved by curing further at 1000 °F.

　　Ceramabond? 503 is an inert, chemically resistant material that will not outgas in ultra high vacuum (UHV).

　　It is also an exceptional electrical insulator providing a volume resistivity of 109 ohms-cm and dielectric strength of 250 volts/mil.

　　Typical applications for Ceramabond? 503 include the assembly of dense ceramic components used in ultra high vacuum equipment, repairing of ceramic sager plates used in furnaces, potting thermocouples and gas sensors, and coating platinum/rhodium resistance wires to alumina heater cores.

　　陶粒宝?503是一种无机、水分散的氧化铝(氧化铝)填充粘合剂，可抵抗3200华氏度(1760℃)的温度，是粘结氧化铝陶瓷的理想选择。它很容易使用刷子，抹刀，或注射器，并在700°F 1-2小时完全固化。机械强度随着温度的升高继续提高，在1000°F下进一步固化可达到900 psi的抗拉剪切强度。

　　陶粒石503是一种惰性、耐化学腐蚀的材料，在超高真空(UHV)条件下不会释放气体。

　　它也是一种特殊的电绝缘体，提供109欧姆-厘米的体积电阻率和250伏/密尔的介电强度。

　　陶拉邦?503的典型应用包括用于超高真空设备的高密度陶瓷组件的组装，用于熔炉的陶瓷sagager板的修复，热电偶和气体传感器的灌装，以及在氧化铝加热器芯上涂层铂/铑电阻线。