Aremco Bond 556-HT-SP Screen Printable Adhesive耐高温胶粘剂

　　Aremco-Bond? 556-HT-SP is an advanced, two-part, silver-filled, screen printable, high temperature, electrically and thermally conductive adhesive used for microelectronic chip bonding, semiconductor die-attach, hybrid packaging, and other electrical and electronic assembly applications to 570°F (299°C).

　　Aremco-Bond 556-HT-SP mixes easily in a 1-to-1 ratio by weight and cures in 1 hour at 350°F. It comes in standard 50-gram kits but can be specially packaged in divided bi-packs or pre-mixed and frozen syringes upon request.

　　Typical applications for Aremco-Bond 556-HT-SP include microelectronic chip bonding, semiconductor die-attach, hybrid packaging, and other electrical and electronic components used in connectors, lighting and sensor components.

　　Aremco-Bond?556-HT-SP是一种先进的两组分、银填充、可丝网打印、高温、导电和导热粘合剂，用于微电子芯片粘接、半导体模接、混合封装和其他电气和电子组装应用，温度为570°F(299°C)。

　　Aremco-Bond 556-HT-SP很容易以1比1的重量比例混合，在350°F下固化1小时。它是标准的50克套件，但可以根据要求特别包装在分开的双包或预混合和冷冻注射器。

　　amco - bond 556-HT-SP的典型应用包括微电子芯片键合、半导体模接、混合封装以及用于连接器、照明和传感器组件的其他电气和电子组件。