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| 品牌 |
AREMCO |
型号 |
Aremco-Bond 556-HT-HC Highly Conductive Epoxy Paste |
Aremco-Bond? 556-HTSP is an advanced, two-part, screen printable, electrically conductive adhesive formulated using high purity silver flake. This system exhibits a volume resistivity of less than 0.0004 ohm-cm at room temperature, and a thermal conductivity of 2.2 W/m-°K. The continuous operating temperature range is 445 °F (230 °C) and intermittent use temperature is 570 °F (300 °C). The tensile shear strength is 1,400 psi and Shore D hardness is 88. Viscosity range is 35,000 to 45,000 cP
Aremco-Bond?556-HTSP是一种先进的、两组分的、可网打印的导电粘合剂，使用高纯银片配制而成。该体系在室温下的体积电阻率小于0.0004欧姆-厘米，热导率为2.2 W/m-°K。连续工作温度范围为445°F(230°C)，间歇使用温度为570°F(300°C)。抗拉剪切强度为1400 psi, Shore D硬度为88。粘度范围为35000到45000 cP
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