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| 品牌 |
AREMCO |
型号 |
Aremco-Bond 568 Epoxy - Good Bond Strength and High Thermal Conductivity |
Aremco-Bond? 568 is an aluminum-filled, two-component (resin:hardener) epoxy paste for special purposes. Provides excellent mechanical strength, high thermal conductivity and good bond strength to 400°F (204°C).
Aremco-Bond 568 should be mixed thoroughly in 1:1 ratio (by weight) to a uniform consistency. Requires curing for 2 hours at 200°F (recommended) or for 24-48 hours at room temperature. In most cases, the epoxy should be applied to both surfaces maintaining a glue line of less than 10 mils.
On the picture Aremco-Bond 568 bonds copper coil.
Aremco-Bond吗?568是一种铝填充，双组份(树脂:硬化剂)环氧糊特殊用途。在400°F(204°C)下，具有优异的机械强度、高导热率和良好的粘结强度。
Aremco-Bond 568应以1:1的比例(按重量)充分混合到均匀的稠度。需要在200°F(推荐)下固化2小时或在室温下固化24-48小时。在大多数情况下，环氧树脂应应用于两个表面，保持胶线小于10密耳。
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