Ceramabond 668 Alumina-Silica Adhesive

　　High temperature one-part alumina-silica based adhesive. Used to encapsulate electrical devices such as thermocouples, oxygen sensors and resistors, and to produce small ceramic fixtures and parts. Excellent for heaters. Bonds and seals ceramics to ceramics and ceramics to metals in applications up to 2500°F (1371°C).

　　Ceramabond 668 exhibits a dielectric strength of 118 volts per mil, torque strength of 38 ft-lbs, and coefficient of thermal expansion of 4.0 in/in/°F.

　　The product must be step cured at 200°F (93°C) for 1-4 hours. Applied in a thin coat using a brush, spatula or dispenser. The clearance between mating parts at operating temperature should be 2-8 mils (50-200 microns). Blistering may occur if the glue line is too thick or heating too rapid. Environmentally safe, non-flammable material, contains no volatile organic compounds.

　　高温单组分铝硅基胶粘剂。用于封装电气设备，如热电偶，氧传感器和电阻，并生产小型陶瓷夹具和零件。优秀的加热器。在高达2500°F(1371°C)的应用中，结合和密封陶瓷到陶瓷和陶瓷到金属。

　　陶粒668的介电强度为118伏/密耳，扭矩强度为38英尺-磅，热膨胀系数为4.0 in/in/°F。

　　产品必须在200°F(93°C)逐步固化1-4小时。用刷子、抹刀或分配器将其涂在薄的涂层上。在工作温度下，配合件之间的间隙应为2-8密尔(50-200微米)。如果胶线太厚或加热过快，可能会发生起泡。环保安全，不易燃材料，不含挥发性有机化合物。