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| 品牌 |
AREMCO |
型号 |
Aremco-Bond 805 Epoxy for Bonding and Molding Applications |
Aremco-Bond? 805 is an aluminum-filled, two-component (resin:hardener) epoxy paste for specialty bonding, molding and potting applications to 570°F (300°C). Provides low shrinkage, high thermal conductivity and excellent mechanical strength.
Aremco-Bond 805 should be mixed thoroghly in 100:12 ratio (by weight) to a uniform consistency. Requires curing for 2 hours at 100°F and then for 2 more hours at 200°F (recommended) or for 24 hours at room temperature plus 2 hours at 200°F. In most cases, the epoxy should be applied to both surfaces maintaining a glue line of less than 10 mils.
On the picture Aremco-Bond 805 bonds aluminum heat sink to a power semiconductor device.
Aremco-Bond?805是一种铝填充的双组份(树脂:硬化剂)环氧浆料，适用于570°F(300°C)的特殊粘合、成型和灌封应用。具有低收缩率，高导热率和优良的机械强度。
Aremco-Bond 805应以100:12的比例(按重量)充分混合，以达到均匀的稠度。需要在100°F下固化2小时，然后在200°F下再固化2小时(推荐)或在室温下固化24小时，再在200°F下固化2小时。在大多数情况下，环氧树脂应应用于两个表面，保持胶线小于10密耳。
在图片上Aremco-Bond 805粘结铝散热器到功率半导体器件。
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