联系人：董经理
邮箱：
电话：13590250016
地址： 中国 广东 深圳市导热硅脂导热胶厂家
| 品牌 |
3M |
型号 |
151250-8322-RB |
| 接口类型 |
1394 |
支持卡数 |
多合一 |
| 读卡类型 |
CF |
外形结构 |
矩形 |
| 制作工艺 |
冷压 |
特性 |
耐温 |
| 加工定制 |
否 |
厂家 |
3M |
Specifications
| Connector Style | Receptacle |
| Contact Base Material | Copper Alloy |
| Current Rating | 1 A |
| Features | Board Location Posts |
| Insulation Material | High Temperature Thermoplastic |
| Markings | Orientation delta and 3M Logo (except surface mount) |
| Maximum Operating Temperature (Celsius) | 105 Degree Celsius |
| Maximum Operating Temperature (Fahrenheit) | 221 Degree Fahrenheit |
| Minimum Operating Temperature (Fahrenheit) | -67 Degree Fahrenheit |
| Tech Sheet Number | TS-0519 |
| Voltage Rating | 500 Vrms at Sea Level |
Details
High Temperature Insulator
Reflow Solder Compatible
Low height helps minimize PCB stack height
End Stackable
Thru-hole versions are side stackable
SMT parts are available in tape and reel pack with vacuum cap for automated placement applications
See Regulatory Information Appendix link for chemical compliance information
For more information, refer to Data Sheet TS0519 (TS-0519)
1502 Series, 2mm Board Mount Socket, SMT, Vertical and Right Angle Thru-Hole
Resources3D Models
XX, 3D Parasolid, rev. 01 (ZIP, 84.1KB)
xx, 3D Step, rev. 01 (ZIP, 199.1KB)
xx, 3D Step, rev. 01 (ZIP, 166.0KB)
xx-xx, 3D IGES, rev. 01 (ZIP, 266.4KB)
xx-xx, 3D Step, rev. 01 (ZIP, 266.4KB)
xx-xx, 3D IGES, rev. 01 (ZIP, 165.7KB)
xx-xx, 3D IGES, rev. 01 (ZIP, 111.6KB)
xx, 3D IGES, rev. 01 (ZIP, 256.6KB)
xx, 3D Step, rev. 01 (ZIP, 146.6KB)
xx, 3D Parasolid, rev. 01 (ZIP, 278.2KB)
xx, 3D IGES, rev. 01 (ZIP, 88.5KB)
xx-xx, 3D Parasolid, rev. 01 (ZIP, 291.1KB)
xx-xx, 3D Parasolid, rev. 01 (ZIP, 339.4KB)
xx, 3D Parasolid, rev. 01 (ZIP, 269.9KB)
xx, 3D IGES, rev. 01 (ZIP, 144.9KB)
xx, 3D IGES, rev. 01 (ZIP, 97.6KB)
xx-xx, 3D Parasolid, rev. 01 (ZIP, 211.9KB)
xx-xx, 3D IGES, rev. 01 (ZIP, 311.4KB)
xx, 3D IGES, rev. 01 (ZIP, 219.2KB)
xx, 3D IGES, rev. 01 (ZIP, 234.4KB)
XX, 3D IGES, rev. 01 (ZIP, 222.1KB)
xx-xx, 3D Parasolid, rev. 01 (ZIP, 435.7KB)
xx, 3D IGES, rev. 01 (ZIP, 265.9KB)
xx, 3D Parasolid, rev. 01 (ZIP, 239.8KB)
xx-xx, 3D Parasolid, rev. 01 (ZIP, 500.3KB)
xx, 3D Parasolid, rev. 01 (ZIP, 179.6KB)
xx-xx, 3D IGES, rev. 01 (ZIP, 378.4KB)
xx, 3D IGES, rev. 01 (ZIP, 153.9KB)
xx-xx, 3D Parasolid, rev. 01 (ZIP, 148.4KB)
xx, 3D IGES, rev. 01 (ZIP, 189.3KB)
xx-xx, 3D Parasolid, rev. 01 (ZIP, 116.9KB)
XX, 3D Step, rev. 01 (ZIP, 54.4KB)
xx, 3D Parasolid, rev. 01 (ZIP, 99.6KB)
xx-xx, 3D IGES, rev. 01 (ZIP, 338.6KB)
xx, 3D IGES, rev. 01 (ZIP, 162.3KB)
xx, 3D IGES, rev. 01 (ZIP, 293.4KB)
xx-xx, 3D Parasolid, rev. 01 (ZIP, 179.6KB)
xx, 3D Step, rev. 01 (ZIP, 180.4KB)
xx, 3D Parasolid, rev. 01 (ZIP, 89.4KB)
xx, 3D Parasolid, rev. 01 (ZIP, 311.0KB)
xx, 3D Parasolid, rev. 01 (ZIP, 250.3KB)
xx, 3D Parasolid, rev. 01 (ZIP, 149.3KB)
xx, 3D Step, rev. 01 (ZIP, 80.9KB)
xx-xx, 3D Step, rev. 01 (ZIP, 216.9KB)
xx, 3D IGES, rev. 01 (ZIP, 284.4KB)
xx, 3D Step, rev. 01 (ZIP, 68.4KB)
xx-xx, 3D Step, rev. 01 (ZIP, 77.6KB)
xx, 3D Parasolid, rev. 01 (ZIP, 169.6KB)
xx, 3D Step, rev. 01 (ZIP, 128.2KB)
xx-xx, 3D Step, rev. 01 (ZIP, 314.6KB)
xx, 3D Step, rev. 01 (ZIP, 94.3KB)
xx, 3D IGES, rev. 01 (ZIP, 199.7KB)
xx, 3D IGES, rev. 01 (ZIP, 79.2KB)
xx-xx, 3D IGES, rev. 01 (ZIP, 379.9KB)
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