83SR05E GJR2369900R1100 ABB耦合模块

　　材料挤出工艺也比其他方法更具成本效益，并且可以使用多个挤出喷嘴轻松实现多材料打印。挤出材料可以用其他材料进行功能化，而不受其他技术（例如选择性激光打印）对添加剂的限制。

　　然而，MEX 打印受到沉积后打印材料快速固化的阻碍。薄弱的界面结合是由层和填充线之间的扩散和缠结限制引起的。几项研究强调了这种技术的局限性，并采用了不同的技术来克服它们。

　　MEX 优化方法

　　在当前的研究中已经探索了几种方法来解决使用 MEX 技术打印的材料的机械各向异性。可以优化打印速度、层高和宽度以及温度等参数，以实现尽可能强的层粘合。可以使用组件的方向。这些方法的缺点是它们必须单独执行，而且设计自由度受到限制。

　　其他方法包括优化材料的特性和制造过程。可以掺入诸如碳纳米管之类的材料，随后使用微波辐射来加热它们并促进聚合物链扩散并提供改善的层之间的粘附性。

　　一些研究报告了使用伽马辐射来诱导长丝中的交联，而其他研究则使用激光来诱导每一层的热能并改善层间粘合。许多这些方法的缺点是成本、对复杂设备的需求以及增加的处理步骤。许多技术未能改善材料的各向同性。

　　将热固性材料引入材料中是另一种在 MEX 印刷材料中实现各向同性的方法。增材制造的一项新研究报告了使用可在低成本 MEX 打印机上打印的热固性聚合物长丝。研究中开发的技术的一个特点是后固化步骤，它可以诱导交联，克服阻碍 MEX 印刷材料的机械各向异性。

　　研究人员已将具有高分子量的固体环氧树脂用于材料配方。可以将带有添加剂的液态环氧树脂加入到材料配方中，从而促进多材料挤出印刷。这有助于将本地化的功能特性合并到打印的组件中。

　　作者在材料中加入了单壁碳纳米管，可提供导电性，他们还表示，印刷材料中还可以加入其他特性，如阻燃性，为多种应用提供了机会。

　　通过用导电纳米粒子修饰材料，可以打印具有传感能力的组件，例如压电传感器。此外，使用碳纳米管可以将温度传感能力整合到使用研究中提出的方法打印的智能组件中。已经对 MEX 打印的用于温度和应变传感应用的功能化材料进行了概念验证研究。

　　该研究确定了进一步的研究机会，包括需要进一步研究传感能力以及关注材料的电各向异性、可重复性和材料中不同填料负载的影响。该研究证明了这种新工艺在开发具有性能的 3D 打印组件方面的潜力，并可能应用于各种先进的电气设备。

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　　Several methods have been explored in current research to address the mechanical anisotropy of materials printed using MEX techniques. Parameters such as printing speed, layer height and width, and temperature can be optimized to achieve the strongest possible layer bonding. The optimal orientation of the component can be used. The drawback to these methods is that they have to be performed individually, and furthermore the design freedom is restricted.

　　Other methods involve optimizing the properties of the material and the fabrication process. Materials such as carbon nanotubes can be incorporated, with subsequent microwave irradiation used to heat them and facilitate polymer chain diffusion and provide improved adhesion between layers.

　　Some studies have reported the use of gamma radiation to induce cross-linking in the filaments, whilst others have used lasers to induce thermal energy to each layer and improve inter-layer bonding. Drawbacks to many of these methods is cost, the need for complex equipment, and increased processing steps. Many techniques fail to improve the isotropy of the materials.

　　Achieving Isotropy in MEX-Printed Epoxy Resin Materials

　　Introducing thermosets into the materials is another method for achieving isotropy in MEX printed materials. A new study in Additive Manufacturing has reported the first use of a thermosetting polymer filament which can be printed on a low-cost MEX printer. A feature of the technique developed in the research is a post-curing step that induces cross-linking, overcoming the mechanical anisotropy that hinders MEX printed materials.

　　A solid epoxy resin, which has a high molecular weight, has been used by the researchers for the material formulation. Liquid epoxy resins with additives can be incorporated into the material formulation, facilitating multi-material extrusion printing. This helps to incorporate localized functional properties into the printed components.

　　The authors have incorporated single-walled carbon nanotubes into the materials, which provides electrical conductivity, and they have stated that other properties such as flame resistance can be incorporated into the printed materials, providing opportunities for utilization in multiple applications.

　　By modifying the materials with electrically conductive nanoparticles, components can be printed with sensing capabilities, such as piezoelectric sensors. In addition, using carbon nanotubes can incorporate temperature sensing abilities into smart components printed using the proposed method in the research. A proof-of-concept study has been performed on the functionalized materials printed by MEX for temperature and strain sensing applications.

　　Further research opportunities have been identified in the study, including the need for further investigation of sensing capabilities and a focus on the effect of the material’s electrical anisotropy, repeatability, and different filler loadings in materials. The research has demonstrated the potential of this novel process for developing 3D printed components with superior properties and possibilities for application in a variety of advanced electrical devices.